发明名称 SPACER DISPOSING METHOD AND SPACER REMOVING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technique for removing a spacer disposed in an unfavorable position. SOLUTION: A discharge liquid is impacted on a workpiece 10, and after the impacted discharge liquid is dried and the spacer is disposed on the workpiece 10, a mask 20 is disposed on the workpiece 10. A light shielding pattern 25 is located on the disposition range where the spacer should be disposed, a laser beam is applied to the surface of the mask 20, and the laser beam is transmitted through a translucent pattern 28 located between the light shielding patterns 25. A laser beam is applied within a removal range of the workpiece 10, and the spacer located within the removal range is separated from the surface of the workpiece 10. The laser beam is not applied to the spacer located in the disposition range, thereby the spacer located within the disposition range is left in the workpiece 10. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010286524(A) 申请公布日期 2010.12.24
申请号 JP20090138024 申请日期 2009.06.09
申请人 ULVAC JAPAN LTD 发明人 KUMITA KENTARO;IGUCHI SHINSUKE
分类号 G02F1/1339;G09F9/30 主分类号 G02F1/1339
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