发明名称 MULTI-CHIP PACKAGED LED LIGHT SOURCE
摘要 A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
申请公布号 US2010320485(A1) 申请公布日期 2010.12.23
申请号 US20100871704 申请日期 2010.08.30
申请人 AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. 发明人 NORFIDATHUL AIZAR ABDUL KARIM;LEE CHIAU JIN;TAN KHENG LENG;NG KEAT CHUAN;ONG KIAM SOON
分类号 H01L33/44;H01L33/52;H01L33/64 主分类号 H01L33/44
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