发明名称 |
ELECTRONIC ASSEMBLY HAVING COMPOSITE ELECTRONIC CONTACTS FOR ATTACHING A PACKAGE SUBSTRATE TO A PRINTED CIRCUIT BOARD |
摘要 |
<p>Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or "collapsing" of the package substrate toward the printed circuit board.</p> |
申请公布号 |
EP1472916(B1) |
申请公布日期 |
2010.12.22 |
申请号 |
EP20030713230 |
申请日期 |
2003.01.10 |
申请人 |
INTEL CORPORATION |
发明人 |
MARTIN, EDWARD, N.;BIGGS, LARRY |
分类号 |
H05K3/34;H01L21/48;H01L21/60;H01L23/48;H01L23/498;H01L23/64;H05K1/02 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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