发明名称 |
FLEXIBLE PRINTED CIRCUIT AND FABRICATION METHOD THEREOF |
摘要 |
A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.
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申请公布号 |
US2010314164(A1) |
申请公布日期 |
2010.12.16 |
申请号 |
US20090568471 |
申请日期 |
2009.09.28 |
申请人 |
WU CHUNG-LUN;CHU FU-AN;LI JA-EE |
发明人 |
WU CHUNG-LUN;CHU FU-AN;LI JA-EE |
分类号 |
H05K9/00;H05K1/00;H05K3/00 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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