发明名称 FLEXIBLE PRINTED CIRCUIT AND FABRICATION METHOD THEREOF
摘要 A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.
申请公布号 US2010314164(A1) 申请公布日期 2010.12.16
申请号 US20090568471 申请日期 2009.09.28
申请人 WU CHUNG-LUN;CHU FU-AN;LI JA-EE 发明人 WU CHUNG-LUN;CHU FU-AN;LI JA-EE
分类号 H05K9/00;H05K1/00;H05K3/00 主分类号 H05K9/00
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