| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electrical system that has a power semiconductor to be improved in heat dissipation and also has a substrate to be miniaturized, and to provide an air conditioner using the electrical system. <P>SOLUTION: The electrical system 10 includes the substrate 12, a leadframe 14 joined to the substrate 12, and an electronic component 16 mounted directly on the leadframe 14. The substrate 12 has an opening 18 penetrating the substrate from one surface to the other surface. The electronic component 16 and a wire 20 are arranged at the opening 18. When a bare chip is mounted on the leadframe 14, it is sealed with a sealing re sin 24 from one surface side of the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
