SULFURIC ACID-BASED COPPER PLATING SOLUTION FOR SEMI-ADDITIVE AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

摘要

PURPOSE: A manufacturing method of sulfate system copper plating liquid for semi-additive and a print circuit board is provided to prevent the property change of a print circuit board due to the remaining metals by processing passivation treatment. CONSTITUTION: A sulfate system copper plating liquid for semi-additive is made from one of 3-mercapto-1-prophansulfon acid or bis(3-sulfopropyl) disulfide. A sprocket hole(2) is formed on both side of a insulation member(10) in a width direction. The sulfate system copper plating liquid for semi-additive includes 4 class ammonium salt polymer and chlorine. 4 class ammonium salt polymer has a ring structure. The copper density of the sulfate system copper plating liquid for semi-additive is 23~55g/L. The sulfate acid concentration of the sulfate system copper plating liquid for semi-additive is 50~250g/L. The concentration of 3-mercapto-1-prophansulfon acid or bis(3-sulfopropyl) disulfide is 8~12mg/L.