| 摘要 |
A method can be used for the production of a coated substrate. The coating contains copper. A copper precursor and a substrate are provided. The copper precursor is a copper(I) complex which contains no fluorine. A copper-containing layer is deposited by means of atomic layer deposition (ALD) at least on partial regions of the substrate surface by using the precursor. Optionally, a reduction step is performed in which a reducing agent acts on the substrate obtained in the layer deposition step. In various embodiments, the precursor is a complex of the formula L2Cu(X∩X) in which L are identical or different &sgr;-donor-&pgr; acceptor ligands and/or identical or different &sgr;,&pgr;-donor-&pgr; acceptor ligands and X∩X is a bidentate ligand which is selected from the group consisting of &bgr;-diketonates, &bgr;-ketoiminates, &bgr;-diiminates, amidinates, carboxylates and thiocarboxylates.
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