WIRING BOARD AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed is a wiring board (10) which comprises a substrate (101), an electronic component (200) that is arranged within the substrate, and a first conductor layer (22) that is arranged on a first surface side of the substrate (101) with a first insulating layer (12) interposed therebetween. A first bottom-side insulating layer (121) and a first top-side insulating layer (122) constituting the first insulating layer (12) are formed from different materials. The first bottom-side insulating layer (121) is arranged on the first surface of the substrate (101) and on the electronic component (200), and the space between the substrate (101) and the electronic component (200) is filled with the material forming the first bottom-side insulating layer (121).