发明名称 Insulated gate type semiconductor device and method for fabricating the same
摘要 In an insulated-gate type semiconductor device in which a gate-purpose conductive layer is embedded into a trench which is formed in a semiconductor substrate, and a source-purpose conductive layer is provided on a major surface of the semiconductor substrate, a portion of a gate pillar which is constituted by both the gate-purpose conductive layer and a cap insulating film for capping an upper surface of the gate-purpose conductive layer is projected from the major surface of the semiconductor substrate; a side wall spacer is provided on a side wall of the projected portion of the gate pillar; and the source-purpose conductive layer is connected to a contact region of the major surface of the semiconductor substrate, which is defined by the side wall spacer.
申请公布号 US7843001(B2) 申请公布日期 2010.11.30
申请号 US20090539383 申请日期 2009.08.11
申请人 RENESAS ELECTRONICS CORPORATION;HITACHI TOBU SEMICONDUCTOR LTD. 发明人 INAGAWA HIROSHI;MACHIDA NOBUO;OISHI KENTARO
分类号 H01L27/06;H01L29/78;H01L21/331;H01L21/336;H01L21/8234;H01L27/04;H01L27/088;H01L29/06;H01L29/12;H01L29/417;H01L29/739 主分类号 H01L27/06
代理机构 代理人
主权项
地址