| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the bonding yield and bonding reliability, by eliminating an influence of a resin remainder on a bonding surface between the surface of a bump electrode and an inner lead, even when applying a resin onto the surface of a tape substrate and bonding the bump electrode of a semiconductor element to the inner lead. <P>SOLUTION: By having a recess formed in a bump electrode 7 on the surface of a semiconductor element 3, and an inner lead 2 formed in a wiring substrate 1 bonded to the recess of the bump electrode 7, even when a resin 8 is applied beforehand for bonding, the resin 8 is also placed in the recess of the bump electrode 7 so that the periphery of the bump electrode 7 can be bonded to the inner lead 2 at one or more locations; and high-yield and high-reliability bonding becomes possible, without blocking the bonding in the vicinity of the recess. <P>COPYRIGHT: (C)2011,JPO&INPIT |
