| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper plating film deposition method capable of reliably forming a conductor circuit of a fine pitch when forming the pattern by the etching, a copper clap laminate, and a method for manufacturing the same. SOLUTION: In the copper plating film deposition method for depositing a copper plating film 18 on a surface of a resin film 2 by applying the current to the resin film 2 immersed in a copper sulfate plating solution, the copper plating is formed by applying the deposition current pulse of the negative current density for depositing copper plating on the resin film 2, and then, the dissolving current pulse of the positive current density for dissolving the copper plating is applied to dissolve the surface side of the copper plating, and the application time of the dissolving current pulse is changed according to the application time of the deposition current pulse to perform the control that the ratio of the deposition of the copper plating to the dissolution of the copper plating is set to be in a range of≥9:1 and≤18:1. COPYRIGHT: (C)2011,JPO&INPIT
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