发明名称 Method for producing SOI substrate
摘要 Provided is a method for producing an SOI substrate having a thick-film SOI layer, in which an ion-implanted layer is formed by implanting at least one kind of ion of hydrogen ion and a rare gas ion into a surface of a bond wafer, an SOI substrate having an SOI layer is produced by, after the ion-implanted surface of the bond wafer and a surface of a base wafer are bonded together via an oxide film, delaminating the bond wafer along the ion-implanted layer, heat treatment is performed on the SOI substrate having the SOI layer in a reducing atmosphere containing hydrogen or an atmosphere containing hydrogen chloride gas, and, after the surface of the SOI layer is polished by CMP, a silicon epitaxial layer is grown on the SOI layer of the SOI substrate.
申请公布号 US7838388(B2) 申请公布日期 2010.11.23
申请号 US20090379938 申请日期 2009.03.04
申请人 SHIN-ETSU HANDOTAI CO., LTD. 发明人 OKA SATOSHI;NOTO NOBUHIKO
分类号 H01L21/76 主分类号 H01L21/76
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