发明名称 THREE-DIMENSIONAL PUNCHING DIE UNIT
摘要 PROBLEM TO BE SOLVED: To punch an object to be three-dimensionally punched while applying fine vibration thereto and reduce wear of an edge abutting part of a receiving member (die for receiving a blade). SOLUTION: A three-dimensional punching die unit includes: a three-dimensional punching die 1 for punching the object to be three-dimensionally punched including a band blade 11 formed by allowing an edge T to three-dimensionally protrude from a surface of a substrate 12 and used by being arranged either at an upper surface plate 61 or at a lower surface plate 62; and a receiving member 18 arranged at a surface plate opposite to the surface plate to allow the three-dimensional punching die 1 to be arranged at and having a surface shape corresponding to the three-dimensional shape of the band blade 11. A plurality of ultrasonic vibration bodies 13 for applying fine vibration to the band blade 11 are arranged along the band blade 11 in the three-dimensional punching die 1. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010260127(A) 申请公布日期 2010.11.18
申请号 JP20090112383 申请日期 2009.05.03
申请人 TAKAHASHI KEISEI:KK 发明人 TAKAHASHI HIROMASA;TAKAHASHI MITSUHIRO
分类号 B26F1/00;B26D7/08 主分类号 B26F1/00
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