发明名称 |
Interconnect for chip level power distribution |
摘要 |
A semiconductor device (601) is provided which comprises a substrate (603); a semiconductor device (605) disposed on said substrate and having a first major surface; a first metal strap (615) which is in electrical contact with said substrate and which is adapted to provide power to a first region (608) of said semiconductor device; and a second metal strap (616) which is in electrical contact with said substrate and which is adapted to provide ground to a second region (609) of said semiconductor device.
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申请公布号 |
US7829997(B2) |
申请公布日期 |
2010.11.09 |
申请号 |
US20070732594 |
申请日期 |
2007.04.04 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
HESS KEVIN J.;LEE CHU-CHUNG;MILLER JAMES W. |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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