| 摘要 |
PURPOSE: The bonding pad structure of a semiconductor device and a method for forming a pad are provided to prevent the generation of cracks in a wire bonding process or a probe test process by changing the shape of a bonding pad. CONSTITUTION: A bonding pad(400) is composed of a plurality of concentric circles. The concentric circles are formed into doughnut shapes. Two grooves are formed to vertically pass through the center of the concentric circles. The width of a radial groove which is formed on a bonding pad is between 0.5 and 1.0um. A protective film(50) is patterned by surrounding the edge of the bonding pad. |
