发明名称 METHOD FOR PREPARING THIN FILM LAMINATED BODY
摘要 PROBLEM TO BE SOLVED: To provide a method for inexpensively and stably thinning film thickness of a metallic thin film of Ag or the like of a thin film laminated body showing successful electric conductivity. SOLUTION: The method comprises forming the metallic thin film whose principal component is at least one selected from a group consisting of Fe, Cu, Ag, W, Au, Pt on a base material using a sputtering method. The method includes the processes of: decompressing the inside of a vacuum chamber installed in a sputtering system; introducing gas containing Ar as atmospheric gas in the vacuum chamber after decompression; and supplying ion current to a sputtering target after introducing the gas, wherein a current value of the ion current is adjusted to be low by containing N<SB>2</SB>gas in the atmospheric gas. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010248606(A) 申请公布日期 2010.11.04
申请号 JP20090143692 申请日期 2009.06.16
申请人 CENTRAL GLASS CO LTD 发明人 NAKANISHI YUKI;KATO KAZUHIRO;OMOTO HIDEO
分类号 C23C14/34;C03C17/09;C03C17/36;C03C27/06;C23C14/14 主分类号 C23C14/34
代理机构 代理人
主权项
地址
您可能感兴趣的专利