| 摘要 |
PROBLEM TO BE SOLVED: To provide a junction which has superior electric characteristics and is improved in connection reliability by suppressing warpage, and to provide method of manufacturing the same. SOLUTION: The method of manufacturing the junction formed by electrically joining a first circuit member and a second circuit member via an anisotropic conductive film containing conductive particles and a photosetting resin includes: a step of arranging the first circuit member, anisotropic conductive film, and second circuit member in this order; a step of applying an ultrasonic wave when pressing the first circuit member and the second circuit member against each other with the anisotropic conductive film interposed therebetween; and a step of irradiating the anisotropic conductive film with light while pressing the first circuit member and the second circuit member against each other with the anisotropic conductive film interposed therebetween after applying the ultrasonic wave. COPYRIGHT: (C)2011,JPO&INPIT |
