LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A light emitting diode is provided to assist with a die bonding process which accurately locates an LED chip by forming a location indicating part in a lead frame. CONSTITUTION: A package body(110) comprises a concave part(112) and a lead frame which is installed in order to be exposed to the concave part. An LED chip(120) is electrically connected to the lead frame. A location indicating part(130) is formed on the lead frame. The location indicating part guides the LED chip to an installation location. The location indication part comprises a first pattern(132) and a second pattern(134).