发明名称 |
POLYAMIDE RESIN COMPOSITION AND MOLDING FORMED OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition and a molding excellent in shock resistance as well as in rigidity and dimensional stability when absorbing water, and excellent in molding property. SOLUTION: The polyamide resin composition contains: (A) a copolyamide resin comprising 70 to 85 mass% of a hexamethylene adipamide unit (N66) obtained from hexamethylene diamine and adipic acid and 15 to 30 mass% of a hexamethylene isophthalamide unit (N6I) obtained from hexamethylene diamine and isophthalic acid; (B) an aliphatic polyamide resin obtained from aminocarboxylic acid and/or a combination of diamine and dicarboxylic acid, in which a ratio (C/N) of the number of carbon atoms to nitrogen atoms included in the resin ranges from 7 to 12; and (C) a glass fiber. The mass ratio (A/B) of the component (A) to the component (B) ranges from 40/60 to 60/40; and the component (C) is included by 20 to 250 parts by mass with respect to total 100 parts by mass of the component (A) and component (B). COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010248402(A) |
申请公布日期 |
2010.11.04 |
申请号 |
JP20090100678 |
申请日期 |
2009.04.17 |
申请人 |
ASAHI KASEI CHEMICALS CORP |
发明人 |
SAKATA NORIO;ISEYA TETSUO |
分类号 |
C08L77/06;C08G69/26;C08K7/20 |
主分类号 |
C08L77/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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