| 摘要 |
A method for forming a solder joint to form an electrical interconnection. In accordance with various embodiments, a solid block of solder is placed onto a previously applied layer of solder paste on an underlying electrically conductive pad. The solid block of solder and the layer of solder paste are concurrently reflowed to form a solder joint. In some embodiments, a pick and place machine is used to respectively place the block of solder and a component onto the layer of solder paste, and the hardened solder joint interconnects a terminal of the component to the pad.
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