| 摘要 |
<p>A plurality of glass substrates for electronic device are produced from one sheet of glass base material through a film formation step (ST 1) that forms an antireflection coating on an entire front face of front and back faces of a glass base material, a resist step (ST2) that provides the entire front face of the glass base material on which the antireflection coating is formed, with a resist layer having hydrofluoric acid resistance, a partition step (ST3) that partitions the glass base material into a plurality of use areas by forming a partition line that does not penetrate, from the front face of the glass base material by laser light or a cutter blade, and an etching step (ST4) that chemically polishes the glass base material having undergone the partition step, to thin the glass base material from the back face side, while deepening the partition line from the front face side.According to the present invention, it is possible to provide a glass substrate for electronic device that allows effective utilization of merits of glass.</p> |
