| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low-cost wiring board having excellent heat radiating properties which may be manufactured with less number of processes. <P>SOLUTION: In a wiring board, a circuit pattern 3 is formed by laminating a copper foil to an insulating layer 2. A metal material is further laminated by a cold spraying method to the upper part of the circuit pattern 3 to increase thickness in order to form an upper circuit pattern 5. Accordingly, even when a power semiconductor 6 is mounted on this thick upper circuit pattern 5, thermal resistance can be reduced because the heat generated by a loss of the same power semiconductor can be diffused by the upper circuit pattern 5. Therefore, it is possible to constitute a wiring board having excellent heat radiating properties and showing remarkably less amount of thermal resistance in comparison with the wiring board of the related art not including the upper circuit pattern 5. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
