| 摘要 |
Sound-attenuating housing (10) for a heat pump (34) comprises a base chassis (11), a first sub-chassis (17) and a second sub-chassis (19). The base chassis (11) is surrounded by upstanding walls (12-15) and has a top (16) adapted to engage with the upstanding walls (12-15), thereby to form an enclosure for the heat pump (34). The first sub-chassis (17) is provided within the enclosure, and is mounted on the base chassis (11) via-anti-vibration mounts (18). The second subchassis (19) is provided within the enclosure, and is mounted on the first sub-chassis (17) via anti-vibration mounts (21). The second sub-chassis (19) forms a mounting surface for a heat pump compressor (25), whilst the first sub-chassis (17) forms a mounting surface for other components of the heat pump (34). |
