| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can prevent deforming of such as lead frame in a resin sealing package of compression forming. <P>SOLUTION: The method of manufacturing semiconductor device, which sandwiches a lead frame between two facing metal molds and resin-seals by compression forming, are as follows: after resin-sealing the inside of the metal mold by compression forming, a movable positioning pin is released till the surface of the sealing resin when the resin is in a half-hardened state, and after the resin is filled up to the space occupied by the positioning movable pin in the metal mold, the resin sealing is carried out by hardening the whole resin. <P>COPYRIGHT: (C)2011,JPO&INPIT |
