| 摘要 |
According to one embodiment, an electronic device includes, a conductive housing, a substrate, a flexible substrate, a reinforcing element, and a conductor. The substrate is configured to be housed in the housing and is mounted with an electronic component. The flexible substrate includes a conductive signal layer stacked on a flexible insulating base material and electrically connected to the substrate, a cover layer covering the signal layer, a first surface mounted with the substrate, and a second surface on the reverse side of the first surface, having a portion where the signal layer is partially exposed. The reinforcing element is provided on the second surface to reinforce the flexible substrate and has an opening corresponding to the portion where the signal layer is partially exposed. The conductor is inserted from the opening of the reinforcing element and connects the signal layer to the housing.
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