发明名称 |
Memory module packaging test system |
摘要 |
A memory module packaging test system may include a plurality of test slots into which a plurality of memory modules may be installed so that the system may simultaneously test the memory modules. The memory module packaging test system may use a server system for a registered dual in-line memory module (RDIMM) or a fully buffered dual in-line memory module (FBDIMM) so that the system may test an unbuffered dual in-line memory module (UDIMM).
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申请公布号 |
US7814379(B2) |
申请公布日期 |
2010.10.12 |
申请号 |
US20070812578 |
申请日期 |
2007.06.20 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JUNG-KUK;HAN YOU-KEUN;SHIN HUI-CHONG |
分类号 |
G11C29/00;G01R31/02 |
主分类号 |
G11C29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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