发明名称 Memory module packaging test system
摘要 A memory module packaging test system may include a plurality of test slots into which a plurality of memory modules may be installed so that the system may simultaneously test the memory modules. The memory module packaging test system may use a server system for a registered dual in-line memory module (RDIMM) or a fully buffered dual in-line memory module (FBDIMM) so that the system may test an unbuffered dual in-line memory module (UDIMM).
申请公布号 US7814379(B2) 申请公布日期 2010.10.12
申请号 US20070812578 申请日期 2007.06.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE JUNG-KUK;HAN YOU-KEUN;SHIN HUI-CHONG
分类号 G11C29/00;G01R31/02 主分类号 G11C29/00
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