发明名称 MULTILAYER WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring board of a strip line structure, microstrip line structure or the like capable of setting characteristic impedance constant. SOLUTION: Linear signal layers 42a-42d are formed on surfaces of dielectric substrates 11, 21, 31 with power layers or ground layers 12, 22, 33 formed on back surfaces thereof; a plurality of square openings 41 independent of one another and having identical sizes are formed on the power layers or ground layers 12, 22, 33; the plurality of openings 41 are arranged to set the respective sides parallel to one another; vertexes V1, V2 of the openings 41b-41e parallel to the respective sides of the opening 41a and adjacent to one another are positioned on extension lines of the respective diagonal lines D1, D2 of the opening 41a; and the signal layers 42a-42d are formed to be parallel to the sides of the opening 41 or form angles of 45°. Thus, distributed capacitance of the signal layers 42a-42d is uniformized. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010226026(A) 申请公布日期 2010.10.07
申请号 JP20090074323 申请日期 2009.03.25
申请人 SONY CORP 发明人 NAKAMURA KIMIHIKO
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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