| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit device, efficiently manufacturing a circuit device which is configured by integrally enclosing a circuit board in a predetermined housing, while meeting required various specifications without making complicated process control. SOLUTION: An adjusting part of the circuit board integrally enclosed in the predetermined housing is configured by a member processed by irradiation with a laser beam, for example, solder, and further a portion facing at least the adjusting part of the circuit board of the housing is formed of a raw material irradiating the adjusting part with the laser beam. After the circuit board is housed in the housing and the housing is sealed, the adjusting part is irradiated with the laser beam from the external part of the housing to process the adjusting part, and an operation mode of the circuit body is set, and/or operation characteristics are adjusted. COPYRIGHT: (C)2011,JPO&INPIT
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