发明名称 |
LAMINATE TYPE CHIP CAPACITOR, LAMINATE TYPE CHIP CAPACITOR ASSEMBLY AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminate type chip capacitor having such a new structure that a user directly adjusts the characteristics of equivalent series resistance (ESR) required by use conditions thereof, a laminate type chip capacitor assembly, and a method of manufacturing the same. <P>SOLUTION: The laminate type capacitor includes: a capacitor body formed by allowing a plurality of dielectric layers to be laminated; a plurality of first and second internal electrodes which are alternately disposed so that the internal electrodes of different polarities face each other via the dielectric layers in the capacitor body; and m (m≥3) pieces of first and second external electrodes each of which is formed in the same number on both sides opposite to each other out of surfaces of the capacitor body. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010219496(A) |
申请公布日期 |
2010.09.30 |
申请号 |
JP20090298040 |
申请日期 |
2009.12.28 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
LEE BYOUNG-HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DONG-SEOK;PARK SANG SOO;PARK MIN CHEOL |
分类号 |
H01G4/30;H01G2/06;H01G4/12;H05K1/18 |
主分类号 |
H01G4/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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