发明名称 LAMINATE TYPE CHIP CAPACITOR, LAMINATE TYPE CHIP CAPACITOR ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laminate type chip capacitor having such a new structure that a user directly adjusts the characteristics of equivalent series resistance (ESR) required by use conditions thereof, a laminate type chip capacitor assembly, and a method of manufacturing the same. <P>SOLUTION: The laminate type capacitor includes: a capacitor body formed by allowing a plurality of dielectric layers to be laminated; a plurality of first and second internal electrodes which are alternately disposed so that the internal electrodes of different polarities face each other via the dielectric layers in the capacitor body; and m (m≥3) pieces of first and second external electrodes each of which is formed in the same number on both sides opposite to each other out of surfaces of the capacitor body. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010219496(A) 申请公布日期 2010.09.30
申请号 JP20090298040 申请日期 2009.12.28
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE BYOUNG-HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DONG-SEOK;PARK SANG SOO;PARK MIN CHEOL
分类号 H01G4/30;H01G2/06;H01G4/12;H05K1/18 主分类号 H01G4/30
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