| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the heat dissipation performance of a solder connection part containing Bi, and to prevent the Bi from being spread to outside of the connection part to form Kirkendall voids in the connection part, and thereby to improve the characteristics of a functional element such as an optical element. <P>SOLUTION: A functional element loading method includes: a conductor layer forming process of forming a first conductor layer 5 in at least a part of a region on which the functional element 1 is mounted, in a main surface side of a substrate 2 on which the functional element 1 is mounted, and forming a second conductor layer 6 in at least a part of the first conductor layer 5; and a connection process of forming a third conductor layer 8 in irregular form in at least a part of the second conductor layer 6, forming a solder 9 in at least a part of the third conductor layer 8, sandwiching a second substrate 17, and connecting and mounting the functional element 1 by melting the solder 9, in which the solder 9 is dammed by the third conductor layer 8 in irregular form so as not to contact the first conductor layer 5. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
