| 摘要 |
<P>PROBLEM TO BE SOLVED: To enlarge a region of a wiring pattern as a whole for high-density packaging in response to multifunction requirement. <P>SOLUTION: An imaging device includes: an element mounting substrate 1 to which a solid-state imaging element 2 is mounted; a first substrate 3 having a first main surface 3a on which the element mounting substrate 1 is laminated, and a second main surface 3b on which central part circuit components 4, ... electrically connected to the solid-state imaging element 2 and composing necessary circuits are arranged; and a frame-shaped second substrate 6 so laminated in the circumferential border of the second main surface 3b of the first substrate 3 as to connect the necessary circuits to an external circuit. An outer shape of the first substrate 3 is composed to be larger than the outer surface of terminals at the lateral side of the second substrate 6. <P>COPYRIGHT: (C)2010,JPO&INPIT |
