发明名称 |
SYSTEM, METHOD AND APPARATUS FOR PULSED INDUCTION HEAT REMOVAL OF COMPONENTS FROM STRUCTURAL ASSEMBLIES |
摘要 |
A pulsed induction heating system removes bonded elements from underlying substrates. A coil loop of a tool fits around the base of the element to be removed. The tool heats the element and the substrate in short pulses that are followed by brief, non-heated wait periods. The temperature of the substrate is measured during the wait periods between pulses to avoid overheating. When the substrate reaches a target temperature, the adhesive is sufficiently softened such that the element and adhesive are readily scraped off without damaging the substrate.
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申请公布号 |
US2010237054(A1) |
申请公布日期 |
2010.09.23 |
申请号 |
US20090407005 |
申请日期 |
2009.03.19 |
申请人 |
LOCKHEED MARTIN CORPORATION |
发明人 |
SEEGMILLER NEAL A.;STREET STUART C. |
分类号 |
H05B1/00 |
主分类号 |
H05B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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