| 摘要 |
<p>Disclosed is an art which secures coupling strength between a base plate and a case member while preventing increases in the size of a conventional semiconductor module. The semiconductor module (1) is provided with: the base plate (2), one surface of which has formed thereon a fin region provided with fins; substrates (3) which are mounted on the other surface of the base plate; and the case member (4) which comprises an internal cavity (40) and is provided with an opening (43), which is smaller than the one surface of the base plate but larger than the fin region, at one of the walls (42). The base plate makes the fins project from the internal cavity to the outside through the opening of the case member, and is tightly bonded to the surface of the internal cavity side of the case member. In addition, the case member, substrate, and base plate are secured by filling the internal cavity with resin.</p> |
