| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a hollow structure element with its metal wiring prevented from peeling off, even if subjected to a high temperature thermal history. <P>SOLUTION: This hollow structure element includes, in order from the side of a substrate, the substrate 1, an Si-containing insulation layer 2, and the metal wiring 3 of Pt or a Pt-base alloy. The substrate 1 is in a hollow state, is structured so as to support the insulation layer 2, and includes an adhesion layer 4 of an oxide between the insulation layer 2 and the metal wiring 3, the oxide having aluminum oxide as its main component. A surface of the insulation layer 2 contacting with the adhesion layer 4 includes an Si-containing layer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
