发明名称 POLISHING RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a polishing resin molding of excellent polishing performance and strength, capable of preventing performance from being deteriorated even when formed into a thin polishing film, and capable of reducing deformation or reduction in strength through use, to allow a long time. SOLUTION: The polishing film is kneaded with at least one kind of polishing particle having 2 or more of Moh's hardness, a pyrolytic temperature or melting point is 400°C or more in a polymer constituting the polishing film, and the tensile strength of the polishing film is 500 MPa or more. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010201591(A) 申请公布日期 2010.09.16
申请号 JP20090051915 申请日期 2009.03.05
申请人 TEIJIN TECHNO PRODUCTS LTD 发明人 WADA NORIKO;AKAMATSU TETSUYA
分类号 B24D11/00;B24B37/12;H01L21/304 主分类号 B24D11/00
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