发明名称 Controlling processing of semiconductor wafers based upon end of line parameters
摘要 A method and an apparatus for processing semiconductor wafer based upon end-of-line (EOL) parameters. A target end-of-line parameter relating to a semiconductor wafer is determined. An inline parameter relating to processing of the semiconductor wafer is controlled in response to the target end-of-line parameter using a controller. Controlling the inline parameter includes adjusting a target inline parameter that correlates to the inline parameter.
申请公布号 US7797073(B1) 申请公布日期 2010.09.14
申请号 US20020156541 申请日期 2002.05.28
申请人 ADVANCED MICRO DEVICES, INC. 发明人 PASADYN ALEXANDER J.;BODE CHRISTOPHER A.
分类号 G06F19/00 主分类号 G06F19/00
代理机构 代理人
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