发明名称 |
Organic solderability preservative comprising high boiling temperature alcohol |
摘要 |
An organic solderability preservative (OSP) composition comprising an alkyl cyclic alcohol and an azole compound having enhanced composition stability against crystallization of the azole compound.
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申请公布号 |
US7794531(B2) |
申请公布日期 |
2010.09.14 |
申请号 |
US20070620857 |
申请日期 |
2007.01.08 |
申请人 |
ENTHONE INC. |
发明人 |
ABYS JOSEPH A.;SUN SHENLIANG |
分类号 |
C23F11/00;C23C22/52;C23C22/58 |
主分类号 |
C23F11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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