发明名称 Organic solderability preservative comprising high boiling temperature alcohol
摘要 An organic solderability preservative (OSP) composition comprising an alkyl cyclic alcohol and an azole compound having enhanced composition stability against crystallization of the azole compound.
申请公布号 US7794531(B2) 申请公布日期 2010.09.14
申请号 US20070620857 申请日期 2007.01.08
申请人 ENTHONE INC. 发明人 ABYS JOSEPH A.;SUN SHENLIANG
分类号 C23F11/00;C23C22/52;C23C22/58 主分类号 C23F11/00
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