| 摘要 |
Method of fabricating 3-dimensional force input control device are disclosed. These roughly follow a process of providing a first substrate having side one and side two, fabricating stress-sensitive IC components and signal processing IC on the side one of the first substrate, fabricating closed trenches on the side two of the first substrate within each die area, said closed trenches create elastic element, frame area and at least one rigid island separated from the frame areas, providing a second substrate having side one and side two, patterning side two of the second substrate to define areas for deep etching, creating a layer of bonding material in the local areas on at least one of the surfaces of the side one of the second substrate and the side two of the first substrate, aligning and bonding the side two of the first substrate with the side one of the second substrate, etching the second substrate from the side two through to the first substrate, dicing two bonded substrates onto multiple separate dice, resulting in processed, aligned, bonded and diced batch fabricated low cost 3D force input control devices.
|
