发明名称 PLATING BATH AND PLATING METHOD USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a plating bath achieving good performance of a plating film and to provide a plating method using the bath. <P>SOLUTION: The plating bath does not substantially contain a cyanide compound but contains: (A) a thiourea compound expressed by chemical formula (1), X<SP>1</SP>X<SP>2</SP>NC(=S)NX<SP>3</SP>X<SP>4</SP>; and (B) at least one of water-soluble salt or water-soluble complex of a metal, as a plating metal, selected from elements in groups 8 to 11, group 12 except for mercury, group 13, group 14 and group 15 in the fourth to sixth periods of the periodical table. In formula (1), X<SP>1</SP>, X<SP>2</SP>, X<SP>3</SP>and X<SP>4</SP>each represents hydrogen, an alkyl or allyl group, or a group expressed by chemical formula (2), -(CHZ<SP>1</SP>-CH<SB>2</SB>-S)<SB>n</SB>-Y. In formula (2), Z<SP>1</SP>represents hydrogen or a methyl group; n represents an integer of 0 to 10; Y represents a group expressed by chemical formula (3), -CHZ<SP>2</SP>-CH<SB>2</SB>-D. In formula (3), Z<SP>2</SP>represents hydrogen or a methyl group; D represents SH, OH, NX<SP>5</SP>X<SP>6</SP>or COOH; X<SP>5</SP>and X<SP>6</SP>may be identical or different from each other; and at least one in X<SP>1</SP>, X<SP>2</SP>, X<SP>3</SP>and X<SP>4</SP>is a group expressed by formula (2). <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010189753(A) 申请公布日期 2010.09.02
申请号 JP20090038368 申请日期 2009.02.20
申请人 DAIWA FINE CHEMICALS CO LTD (LABORATORY);KYOTO ICHI;NAKAMURA TOSHIHIRO;MIZUTANI YASUSHI;METEK KITAMURA CO LTD 发明人 YOSHIMOTO MASAKAZU;KITAMURA SHINGO;KAWAGUCHI KEIKO;INOUE NAOYA;NAKAMURA TOSHIHIRO;MIZUTANI YASUSHI;NAKAI YOJI;NAWAFUNE HIDEMI
分类号 C25D3/58 主分类号 C25D3/58
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