发明名称 Image sensor and method for manufacturing the same
摘要 An image sensor including a substrate and an interlayer dielectric layer divided into a pixel region and a logic pad region. An image sensor may include at least one of the following: a color filter, an over coating layer, and a micro lens sequentially formed over the interlayer dielectric layer in the pixel region; a top conductive layer formed over the interlayer dielectric layer of the logic pad region; an etch stop layer formed over the interlayer dielectric layer in the logic pad region and on the sides and a portion of an upper surface of a top conductive layer; and a first and second protective layers sequentially formed over the etch stop layer.
申请公布号 US7785914(B2) 申请公布日期 2010.08.31
申请号 US20070831551 申请日期 2007.07.31
申请人 DONGBU HITEK CO., LTD. 发明人 KIM YUNG-PIL
分类号 H01L21/00;H01L31/062;H01L31/113 主分类号 H01L21/00
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