| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin resin sealed semiconductor device which does not produce inconvenience even if it deals with big current capacity, and to provide a thin resin sealed semiconductor device and lead frame capable of surface mounting, excelling in reliability and durability compared with a conventional type. <P>SOLUTION: The resin sealed semiconductor device comprises a semiconductor device 11, a die pad 12 for mounting the semiconductor device 11, a sealing resin body 32 for sealing the semiconductor device 11, an external terminal 15 for connecting with the exterior, and an internal lead 25 for connecting the external terminal 15 and the semiconductor device 11. The external terminal 15 has an external terminal pad area 16 where thickness is thinner than the thickness of the side of the exterior in the tip of the external terminal 15 which is a side near the semiconductor device 11. The internal lead 25 is connected with the external terminal 15 by connecting with the external terminal pad area 16. The thickness of the side of the exterior of the external terminal 15 is equal to the thickness added by the thickness of the external terminal pad area 16 and the thickness of the internal lead 25. Otherwise, it is thinner than the thickness added by the thickness of the external terminal pad area 16 and the thickness of the internal lead 25. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
