发明名称 Light Emitting Diode Assembly and Methods
摘要 Exemplary systems and methods for LED light engines include an LED package with electrical leads, each lead forming a compliant portion for making electrical and mechanical connection upon insertion into a receptacle of a circuit substrate. In an illustrative example, the electrical and mechanical connections may be formed upon the insertion of the compliant portion into the receptacle and without further process steps involving solder. Various examples may further include an elongated thermal dissipation member extending from a bottom of a package that contains the LED, where the elongated thermal member (e.g., tab) may be in substantial thermal communication with the LED die. As an example, the tab may provide a substantially reduced thermal impedance for dissipating heat from the LED die. Upon insertion into a circuit substrate, the LED package may be releasable by mechanical extraction without applied heat to facilitate repair or replacement, for example.
申请公布号 US2010207150(A1) 申请公布日期 2010.08.19
申请号 US20100705408 申请日期 2010.02.12
申请人 ONCE INNOVATIONS, INC. 发明人 GRAJCAR ZDENKO
分类号 H01L33/00 主分类号 H01L33/00
代理机构 代理人
主权项
地址