发明名称 OBSERVING DEVICE AND METHOD
摘要 When a semiconductor device 11 is observed, first, when it is detected that a solid immersion lens 6 comes into contact with the semiconductor device 11, the solid immersion lens 6 is caused to vibrate by a vibration generator unit. Next, a reflected light image from the solid immersion lens 6 is input to calculate a reflected light quantity m of the reflected light image, and it is judged whether a ratio (m/n) of the reflected light quantity m to an incident light quantity n is not greater than a threshold value A. When the ratio (m/n) is greater than the threshold value A, it is judged that optical close contact between the solid immersion lens 6 and the semiconductor device 11 is not achieved, and the solid immersion lens 6 is again caused to vibrate. When the ratio (m/n) is not greater than the threshold value A, it is judged that optical close contact between the solid immersion lens 6 and the semiconductor device 11 is achieved, and an observed image of the semiconductor device 11 is acquired. Thereby, achieving an observation apparatus and method capable of improving the close contact between the solid immersion lens and an observation object.
申请公布号 US2010202041(A1) 申请公布日期 2010.08.12
申请号 US20080665588 申请日期 2008.06.13
申请人 HAMAMATSU PHOTONICS K.K. 发明人 TERADA HIROTOSHI;TANABE HIROSHI
分类号 G02B21/02 主分类号 G02B21/02
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