发明名称 POWER SUPPLY DEVICE FOR HIGH-FREQUENCY HEATING ARRANGEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a power supply device for a high-frequency heating arrangement, which reduces noise leaked from the switching power supply of the high-frequency heating arrangement. <P>SOLUTION: The power supply device for the high-frequency heating arrangement includes: a semiconductor rectifying element 3 to rectify power of a commercial power supply; a filter circuit to suppress noise leakage to the commercial power supply in its preceding stage; a capacitor 5 to smoothen a dc current after rectification; semiconductor switching elements 21, 22 to change smoothened power to high-frequency power; a high-frequency transformer 11 to boost and supply the high-frequency power to a magnetron; heat sinks 32, 33 mounted for heat dissipation of these elements 3, 21, 22; and a circuit board to mount these elements 3, 21, 22, the high voltage transformer 11, and the heat sinks, wherein the base plate of the semiconductor switching element 22 is connected to the smoothing capacitor 5. Noise leakage to the commercial power supply through stray capacitance between the heat sink 32 to which the elements 3 and 22 are attached and the AC line pattern of the circuit board and between the heat sink 32 and the semiconductor rectifying element 3 can be reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010177100(A) 申请公布日期 2010.08.12
申请号 JP20090019727 申请日期 2009.01.30
申请人 SHARP CORP 发明人 MASUDA SHINICHI
分类号 H05B6/68;H02M7/48;H05B6/66 主分类号 H05B6/68
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