| 摘要 |
PROBLEM TO BE SOLVED: To suppress damages to insulating substrates with a simple structure, by relaxing the thermal stresses generated in a process for jointing the insulating substrates, stress-relaxing members, and heat sinks in heat radiators. SOLUTION: The heat sink 18 includes a top board 28 joined to the stress relaxing member 16, and a baseplate 32 that is joined to the top board 28 and forms a channel 30 for a cooling liquid in a portion to the top board 28. The ratio of the thickness of the top board 28 to that of the bottom plate 32 is set from 1:3 to 1:5, thus relaxing the thermal stresses generated in the process for joining the insulating substrate 14, the stress relaxing member 16, and the heat sink 18, and hence being capable of suppressing damages to the insulating substrate 14. COPYRIGHT: (C)2010,JPO&INPIT |
