RESIN COMPOSITION

摘要

Provided is a resin composition suitable for the formation of an insulating layer on a circuit board, which allows the formation of a conductive layer that has a strong peeling strength even if the insulating layer obtained by curing the resin composition has a low surface roughness. The resin composition comprises (A) a polyfunctional epoxy resin, (B) a phenolic curing agent and/or active ester curing agent, (C) a thermoplastic resin, (D) an inorganic filler, and (E) a predetermined curing accelerator.