发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 In a rear surface incidence type CMOS image sensor having a wiring layer 720 on a first surface (front surface) of an epitaxial substrate 710 in which a photodiode, a reading circuit (an n-type region 750 and an n+ type region 760) and the like are disposed, and a light receiving plane in a second surface (rear surface), the photodiode and a P-type well region 740 on the periphery of the photodiode are disposed in a layer structure that does not reach the rear surface (light receiving surface) of the substrate, and an electric field is formed within the substrate 710 to properly lead electrons entering from the rear surface (light receiving surface) of the substrate to the photodiode. The electric field is realized by providing a concentration gradient in a direction of depth of the epitaxial substrate 710. Alternatively, the electric field can be realized by providing a rear-surface electrode 810 or 840 for sending a current.
申请公布号 US2010194950(A1) 申请公布日期 2010.08.05
申请号 US20100762997 申请日期 2010.04.19
申请人 SONY CORPORATION 发明人 MABUCHI KEIJI
分类号 H04N5/335;H01L27/14;H01L27/146;H01L31/14;H01L31/18 主分类号 H04N5/335
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