| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing die bonding film which, even if a workpiece is thin, retains superior characteristics of the balance between a retaining force in dicing the workpiece and peeling properties in peeling a chipped workpiece produced by dicing together with a die bonding film. <P>SOLUTION: This dicing die bonding film includes a dicing film having an adhesive layer 2 on a substrate 1 and a die bonding film provided on the adhesive layer. In this case, the adhesive layer includes a polymer comprising an acrylic ester as a main monomer, a hydroxyl-containing monomer whose content is in the range of 10 to 30 mol% relative to the amount of the acrylic ester, and an isocyanate compound having a radical-reactive carbon-carbon double bond whose content of is in the range of 70 to 90 mol% relative to the amount of the hydroxyl-containing monomer, and the die bonding film includes an epoxy resin. <P>COPYRIGHT: (C)2010,JPO&INPIT |
