发明名称 METAL LAYER LAMINATE HAVING ROUGHENED METAL SURFACE LAYER AND METHOD FOR PRODUCING THE SAME
摘要 Provided are a metal layer laminate that includes a roughened metal surface layer having a surface profile capable of strongly adhering to resin materials even when the surface roughness is small, and a simple method for producing a metal layer laminate having good adhesion to resin materials such as a resin substrate for a metal layer and an insulating resin film formed on the surface of a metal wiring portion. The metal layer laminate includes a metal layer, a resin thin film, and a roughened metal surface layer, wherein the resin thin film and the roughened metal surface layer are formed on the surface of the metal layer, a fractal-shaped interface structure appears between the resin thin film and the roughened metal surface layer, when the metal layer laminate is cut in a normal direction, and the interface structure has a fractal dimension of 1.05 to 1.50 as calculated using a box counting method with the measurement object region being set to from 50 nm to 5 μm and the box size (pixel size) being set to 1/100 or less of the measurement object region. The metal layer laminate is obtained by a production method including the steps of forming a resin thin film on the surface of a metal layer and subjecting the resin thin film-carrying metal layer to a plating process.
申请公布号 US2010190029(A1) 申请公布日期 2010.07.29
申请号 US20080666807 申请日期 2008.06.09
申请人 FUJIFILM CORPORATION 发明人 UEKI SHIKI
分类号 B32B5/00;B05D5/12;C25D5/56 主分类号 B32B5/00
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