发明名称 AN INTEGRATED WAFER TRANSFER MECHANISM
摘要 <p>An integrated high speed robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly typically comprises an end effector for moving the object in and out of a chamber, a rotation chuck incorporated on the robot body to provide centering and theta alignment capability, and an optional identification subsystem for identifying the object during transport. The present invention also discloses a transfer robot system, employing a plurality of integrated robot assemblies; a transfer system where a transfer robot system can service a plurality of connected chambers such as FOUP or FOSB; a front end module (FEM); or a sorter system. Through the use of these incorporated capabilities into the moving robot, single object transfer operations can exceed 500 parts per hour.</p>
申请公布号 KR20100085066(A) 申请公布日期 2010.07.28
申请号 KR20107008842 申请日期 2008.09.22
申请人 DYNAMIC MICROSYSTEMS SEMICONDUCTOR EQUIPMENT GMBH 发明人 BARKER DAVID;LOBIANCO ROBERT;MANTRIPRAGADA SAI;TABRIZI FARZAD
分类号 H01L21/677;B65G49/07;H01L21/68 主分类号 H01L21/677
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